SBO: GigaPixel

Full Name: CMOS imager scaling below wavelength limits

Duration: 1/10/2021-30/12/2024

Partners:

• IMEC
• KU Leuven
• UGent

Objective:

• Color splitter design:
• This involves the design and optimization of vertical waveguide structures, taking into account the boundary conditions set by the process technology and the development of a fast design parameter screening procedure, using advanced optimization strategies.
• Vertical waveguide array fabrication:
• Process development and stack fabrication using state-of-the-art 300mm equipment. Follow up of process steps and full stack fabrication with analysis methods using focused ion beam preparation, high resolution scanning electron microscopy, and scanning probe microscopy.
• Optical characterization:
• Vertical waveguide stack analysis of transmitted light by confocal microscopy and scanning near-field optical microscopy.
• High temperature stable thin film photodetector:
• Development of high temperature (>350°C) stable perovskite photodetectors including layers with charge transport and charge blocking properties for the opposite charge. A high quantum efficiency over the full optical spectrum is targeted with low dark current densities.
• Full device integration:
• Proof-of-concept designs of the combination of read-out backplane, thin film photodetector and vertical waveguide stack should demonstrate the capabilities of the proposed GigaPixel concept over state-of-the-art sensor technology. Different optical waveguide designs are benchmarked for their application feasibility.

INTEC's Role:

• Optical characterization of colour splitters

People involved

• Meryem Benelajla