Projects

EIC Transition challenge: AMICA

Full Name: Adaptive microcombs for innovative connectivity in datacenter applications and optical clocks

Duration: 1/8/2024-31/7/2027

Partners:

Objective:

Amica builds upon a breakthrough wafer-scalable, super-efficient microcomb technology to realize critical demonstrators in WDM CPO, aiming at petabit-per-second aggregate speeds in a mass-manufacturable platform with unprecedented combination of channel count, efficiency, line spacing and power per line. The consortium brings a synergetic effort among an industrial leader in datacentre interconnects and high-performance computing, academic partners with complementary expertise in integrated photonics and an emerging startup that owns the intellectual property rights for commercialization. The team is complemented with an innovation office to lead the tech to market transition, and two associated partners who will help testing the technology for emerging markets beyond telecom.

INTEC's Role:

UGENT will equip AMICA with O-band III-V semiconductor active blocks and active devices using micro-transfer-printing