Micro-transfer printing of thin films

Inventors:	T. Vandekerckhove , T. Vanackere , G. Roelkens , S. Clemmen , B. Kuyken
Title:	Micro-transfer printing of thin films
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Abstract

A method for forming a device coupon (100) comprises the steps of providing a source wafer (1) that includes a source substrate (10), a sacrificial layer (11), and a film (12); forming at least one device coupon (100) in the film (12); designing one or more breakable tethers to secure the device coupon (100) to the film (12); etching one or more recesses (111) extending through the device coupon (100), thereby exposing the sacrificial layer (11); etching the sacrificial layer (11) away at least partially through one or more of the recesses (111), thereby forming one or more sacrificial recesses (121) in the sacrificial layer (11); and filling at least some pairs of recesses (111) and sacrificial recesses (121) with a support material (200), thereby forming support structures (220) for the device coupon (100).

Related Research Topics

• Transfer printing technology