Authors:	G. Roelkens, D. Van Thourhout, R. Baets
Title:	Ultra-thin benzocyclobutene bonding of III-V dies onto SOI substrates
Format:	International Journal
Publication date:	4/2005
Journal/Conference/Book:	Electronics Letters
Volume(Issue):	41(9) p.561-562
DOI:	10.1049/el:20050807
Citations:	30 (Dimensions.ai - last update: 15/12/2024) 21 (OpenCitations - last update: 3/5/2024) Look up on Google Scholar
Download:	(1.2MB)

Related Research Topics

• Die-to-wafer bonding technology (2003-2012)