Authors:	G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets
Title:	Adhesive bonding of III-V dies to processed SOI using BCB for photonic applications
Format:	International Conference Proceedings
Publication date:	9/2006
Journal/Conference/Book:	210th Electrochemical Society meeting
Location:	Cancun, Mexico
DOI:	10.1149/1.2357082
Citations:	Look up on Google Scholar
Download:	(451KB)

Related Research Topics

• Die-to-wafer bonding technology (2003-2012)

Related Projects

• IWT: GBOU (Generic Technologies for Plastic Photonics)
• IST: PICMOS (Photonic Interconnect Layer on CMOS by wafer-scale integration)
• IWT: epSOC (electro-photonic System-On-Chip)