| Authors: | G. Roelkens, J. Brouckaert, D. Van Thourhout, R. Baets, R. Notzel, M. Smit | | Title: | Adhesive Bonding of InP/InGaAsP Dies to Processed Silicon-on-Insulator Wafers using DVS-bis-Benzocyclobutene | | Format: | International Journal | | Publication date: | 11/2006 | | Journal/Conference/Book: | Journal of Electrochemical Society
| | Volume(Issue): | 153(12) p.G1015-G1019 | | DOI: | 10.1149/1.2352045 | | Citations: | 107 (Dimensions.ai - last update: 14/4/2024)
91 (OpenCitations - last update: 3/5/2024)
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