| Authors: | J.M. Fedeli, E. Augendre, J.-M. Hartmann, L. Vivien, P. Grosse, V. Mazzocchi, W. Bogaerts, D. Van Thourhout, F. Schrank | | Title: | Photonics and Electronics Integration in the HELIOS project | | Format: | International Conference Proceedings | | Publication date: | 9/2010 | | Journal/Conference/Book: | Group IV Photonics 2010
| | Volume(Issue): | p.FC2 | | Location: | Beijing, China | | DOI: | 10.1109/group4.2010.5643326 | | Citations: | 9 (Dimensions.ai - last update: 14/4/2024)
7 (OpenCitations - last update: 3/5/2024)
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Abstract
The objective of the European project HELIOS is to combine a photonic layer with a CMOS circuit by different innovative means, using microelectronics processes. Bonding of AWG + Ge Photodiodes on CMOS wafer is achieved. Related Research Topics
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