Authors:	S. Stankovic, Jones, Richard, Sysak, Matthew, Heck, John, G. Roelkens, D. Van Thourhout
Title:	Hybrid III-V/Si Distributed Feedback Laser Based on Adhesive Bonding
Format:	International Journal
Publication date:	12/2012
Journal/Conference/Book:	IEEE Photonics Technology Letters
Volume(Issue):	24(23) p.2155-2158
DOI:	10.1109/lpt.2012.2223666
Citations:	85 (Dimensions.ai - last update: 15/12/2024) 57 (OpenCitations - last update: 10/5/2024) Look up on Google Scholar
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Abstract

A hybrid, evanescently-coupled III-V/Silicon distributed feedback laser with an integrated monitor photodiode, based on adhesive divinyl siloxane-benzocyclobutene bonding and emitting at 1310 nm is presented. An output power of ~ 2.85 mW is obtained in continuous wave (CW) regime at 10 °C. The threshold current is 20 mA and a side mode suppression ratio of 45dB is demonstrated. Optical feedback is provided via corrugations on top of the silicon rib waveguide while a specially developed bonding procedure yields 40nm-thick adhesive bonding layers, enabling efficient evanescent coupling.

Related Research Topics

• Die-to-wafer bonding technology (2003-2012)

Related Projects

• ERC-StG: ULPPIC (Ultra Low Power Photonic IC)