Authors:	Y. Xing, J. Dong, U. Khan, W. Bogaerts
Title:	Hierarchical Model for Spatial Variations of Integrated Photonics
Format:	International Conference Proceedings
Publication date:	8/2018
Journal/Conference/Book:	IEEE International Conference on Group IV Photonics
Editor/Publisher:	IEEE,
Volume(Issue):	p.91-92 (WD4)
Location:	Cancun, Mexico
DOI:	10.1109/GROUP4.2018.8478733
Citations:	9 (Dimensions.ai - last update: 15/12/2024) 7 (OpenCitations - last update: 27/6/2024) Look up on Google Scholar
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Abstract

The paper presents a hierarchical model that decomposes the spatial process variations of integrated photonics into different levels. We performed an analysis of automated wafer measurements and derived systematic intra-wafer variation and systematic intra-die variation of the wafer.

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• Variability Aware Design

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