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Authors: J. Zhang, G. Muliuk, C. Op de Beeck, J. Goyvaerts, B. Haq, S. Kumari, B. Kuyken, J. Van Campenhout, R. Baets, G. Roelkens, J. Van Campenhout, G. Lepage, P. Verheyen, A. Gocalinska, E. Pelucchi, B. Corbett, A. Jose Trindade, C. Bower
Title: Micro-transfer printing for photonic integrated circuits
Format: International Conference Proceedings
Publication date: 10/2019
Journal/Conference/Book: International Conference on Wafer Bonding (WaferBond)
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Micro-transfer-printing is a promising technology for the realization of complex and powerful photonic integrated circuits. It enables the manipulation micro-components in a massively parallel manner and allows for the scalable integration of diverse functionalities on silicon photonic platforms at low-cost.

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