Authors:	G. Van Steenberge, G. Roelkens, P. Ossieur, J. Missinne, J. Van Asch, J. Zhang, S. Qin, J. Van Campenhout, J. Van Kerkhof, M. Milosevic, P. Bakopoulos, D. Syrivelis, E. Mentovich, K. Mozorov, S. Stracca, A. Bigongiari, T. Joerg, D. Schlick, T. Braun, M. Wohrmann, R. Gernhardt, Q. Cheng, T. Li, R. Penty
Title:	Packaging of ultra-dynamic photonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems
Format:	International Conference Proceedings
Publication date:	12/2023
Journal/Conference/Book:	IEEE Electronic Components and Technology Conference
Volume(Issue):	p.742-747
DOI:	10.1109/ECTC51909.2023.00129
Citations:	2 (Dimensions.ai - last update: 15/12/2024) Look up on Google Scholar
Download:	(1.3MB)

Related Research Topics

• Transfer printing technology