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Authors: P. Edinger, G. Jo, S.J. Bleiker, A.Y. Takabayashi, N. Quack, P. Verheyen, U. Khan, W. Bogaerts, C. Antony, F. Niklaus, K.B. Gylfason
Title: An Integrated Platform for Cavity Optomechanics with Vacuum-Sealed Silicon Photonic MEMS
Format: International Conference Proceedings
Publication date: 6/2023
Journal/Conference/Book: 2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)
Volume(Issue): p.425-428
Location: Kyoto, Japan
Citations: Look up on Google Scholar
Download: Download this Publication (1.8MB) (1.8MB)


Silicon photonics is an excellent platform for integrated cavity optomechanics due to silicon's high light confinement and favorable mechanical properties. However, optomechanical devices require a vacuum environment to inhibit damping due to air.We present an integrated platform for cavity optomechanics using thermo-compression bonding of silicon caps to provide on-chip vacuum sealing. We demonstrate optomechanical coupling in a vacuum-sealed ring resonator implemented on the platform, either by modulation of the laser power or by using an electrostatic phase shifter in the ring.By enabling optomechanics on a standard platform, we aim to make the technology available to a wider user base.

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