Authors: | T. Ma, L. Yang, Y. Li, Y. Du | Title: | Non-Contact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects | Format: | International Journal | Publication date: | 12/2024 | Journal/Conference/Book: | IEEE Transactions on Components, Packaging and Manufacturing Technology
| Volume(Issue): | 15(1) p.232-234 | DOI: | 10.1109/TCPMT.2024.3511042 | Citations: | Look up on Google Scholar
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