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Authors: T. Ma, L. Yang, Y. Li, Y. Du
Title: Non-Contact Integration of Photonic IC and Electronic IC via Inductively Coupled Interconnects
Format: International Journal
Publication date: 12/2024
Journal/Conference/Book: IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume(Issue): 15(1) p.232-234
DOI: 10.1109/TCPMT.2024.3511042
Citations: Look up on Google Scholar
Download: Download this Publication (3.4MB) (3.4MB)

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