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H2020 : PhotonicLEAP

Full Name: ​Photonic Wafer-Level IntEgration PAckaging and Test Processes

Duration: 1/1/2021-31/12/2024

Project Web site: https://photonicleap.com/index.html

People involved

Research topics involved

See also:

  • https://cordis.europa.eu/project/id/101016738

Publications in the framework of this project (2)

    International Journals

      International Conferences

    1. M. Ghomashi, R. Baets, Y. Li, Design and Optimizing Backside Grating Couplers in Si-Photonics Circuits, 2023 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD), Italy, doi:10.1109/NUSOD59562.2023.10273523 (2023).