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Authors: J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, S. Qin, E. Soltanian, S. Cuyvers, D. Maes, T. Vanackere, T. Vandekerckhove, S. Poelman, M. Kiewiet, I. Luntadila Lufungula, X. Guo, H. Li, J. De Witte, G. Lepage, P. Verheyen, J. Van Campenhout, B. Kuyken, G. Morthier, D. Van Thourhout, R. Baets, G. Roelkens
Title: Photonic integrated circuits realized using micro-transfer printing
Format: International Conference Proceedings
Publication date: 7/2023
Journal/Conference/Book: PIERS (invited)
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We present our work on heterogeneous integration through micro-transfer printing of opto-electronic components and material films on Si/SiN photonics integrated circuits with minimal modification to the existing silicon photonics process flow.

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