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Most cited publications of Senbiao Qin
| 38 |
Micro-transfer printing for heterogeneous Si photonic integrated circuits,
G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Krückel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila Lufungula, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets,
IEEE Journal on Selected Topics in Quantum Electronics (invited), 29(3), p.8200414 doi:10.1109/JSTQE.2022.3222686 (2022) |  |
| 5 |
Photonic network-on-wafer for multi-chipset GPUs,
S. Zhang, Z. Zhang, M. Naderan-Tahan, H. Seyyed Aghaei, X. Wang, H. Li, S. Qin, D. Colle, G. Torfs, M. Pickavet, J. Bauwelinck, G. Roelkens, L. Eeckhout,
IEEE Micro, March/April(2023), p.86-95 doi:10.1109/MM.2023.3237927 (2023) | |
| 4 |
Present and future of micro-transfer printing for heterogeneous photonic integrated circuits,
G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E.Delli, D. Wang, V. Bonito-Oliva, T. N. L Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y.Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken,
Applied Physics Letters - Photonics (invited), doi:10.1063/5.0181099 (2024) | |
| 1 |
Packaging of ultra-dynamic photonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems,
G. Van Steenberge, G. Roelkens, P. Ossieur, J. Missinne, J. Van Asch, J. Zhang, S. Qin, J. Van Campenhout, J. Van Kerkhof, M. Milosevic, P. Bakopoulos, D. Syrivelis, E. Mentovich, K. Mozorov, S. Stracca, A. Bigongiari, T. Joerg, D. Schlick, T. Braun, M. Wohrmann, R. Gernhardt, Q. Cheng, T. Li, R. Penty,
IEEE Electronic Components and Technology Conference, p.742-747 doi:10.1109/ECTC51909.2023.00129 (2023) | |
Most cited publications of Senbiao Qin (since 2019)
| 38 |
Micro-transfer printing for heterogeneous Si photonic integrated circuits,
G. Roelkens, J. Zhang, L. Bogaert, M. Billet, D. Wang, B. Pan, C.J. Krückel, E. Soltanian, D. Maes, T. Vanackere, T. Vandekerckhove, S. Cuyvers, J. De Witte, I. Luntadila Lufungula, X. Guo, H. Li, S. Qin, G. Muliuk, S. Uvin, B. Haq, C. Op de Beeck, J. Goyvaerts, G. Lepage, P. Verheyen, J. Van Campenhout, G. Morthier, B. Kuyken, D. Van Thourhout, R. Baets,
IEEE Journal on Selected Topics in Quantum Electronics (invited), 29(3), p.8200414 doi:10.1109/JSTQE.2022.3222686 (2022) | |
| 5 |
Photonic network-on-wafer for multi-chipset GPUs,
S. Zhang, Z. Zhang, M. Naderan-Tahan, H. Seyyed Aghaei, X. Wang, H. Li, S. Qin, D. Colle, G. Torfs, M. Pickavet, J. Bauwelinck, G. Roelkens, L. Eeckhout,
IEEE Micro, March/April(2023), p.86-95 doi:10.1109/MM.2023.3237927 (2023) | |
| 4 |
Present and future of micro-transfer printing for heterogeneous photonic integrated circuits,
G. Roelkens, J. Zhang, L. Bogaert, E. Soltanian, M. Billet, A. Uzun, B. Pan, Y. Liu, E.Delli, D. Wang, V. Bonito-Oliva, T. N. L Tran, X. Guo, H. Li, S. Qin, K. Akritidis, Y.Chen, Y. Xue, M. Niels, D. Maes, M. Kiewiet, T. Reep, T. Vanackere, T. Vandekerckhove, I. Luntadila Lufungula, J. De Witte, L. Reis, S. Poelman, Y. Tan, H. Deng, W. Bogaerts, G. Morthier, D. Van Thourhout, B. Kuyken,
Applied Physics Letters - Photonics (invited), doi:10.1063/5.0181099 (2024) | |
| 1 |
Packaging of ultra-dynamic photonic switches and transceivers for integration into 5G radio access network and datacenter sub-systems,
G. Van Steenberge, G. Roelkens, P. Ossieur, J. Missinne, J. Van Asch, J. Zhang, S. Qin, J. Van Campenhout, J. Van Kerkhof, M. Milosevic, P. Bakopoulos, D. Syrivelis, E. Mentovich, K. Mozorov, S. Stracca, A. Bigongiari, T. Joerg, D. Schlick, T. Braun, M. Wohrmann, R. Gernhardt, Q. Cheng, T. Li, R. Penty,
IEEE Electronic Components and Technology Conference, p.742-747 doi:10.1109/ECTC51909.2023.00129 (2023) | |
Types of Publications
Invited Publications
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